ATLAS
BLADE SERIES
BLADE SERIES
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WHEELS SERIES
ELECTROPLATED SERIES
ELECTROPLATED SERIES
Product Detail
Grinding wheels(Resin-bond Wheels)
Code: B003
Products

Grinding wheels(Vitrified-bond Wheels)

The Vitrified-bond wheels are porous,which mainly used for back thinning of wafer.This Kind of grinding wheels also have a long life and high-speeding  .





Feature

ØPorous

ØHigh-speed(Vmax=500μm/min)

ØLong life and good quality

ØOffer variety of special requirements.




Material of workpieces

Discrete device ,silicon wafe



Specifications

SD 320  07 195D 5W 10X  25T


SD

320

V70

195D

*

170H

*

5W

*

10X

*

25T

Abrasive


Grit

Bond

OD


ID


W


H


T







HOW TO MAKE AN ORDER          

More details for your description,more proper blades or wheels you could get,please let us know :            

Type :such as 1A8.1V8,1E8...  

Size:Diameter,Thickness,Hole,Width and depth of abrasive layer,angle                        Specification Abrasive(D or CBN),Grit,Bond,Concentration  

Work-piece Material ,Grinding process(wet or dry)  



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