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Product Detail
Grinding wheels(Vitrified-bond Wheels)
Products


Grinding wheels(Metal-bond Wheels)


 The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial  wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.







Processing Materials



Material of workpieces:

Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer



Specifications

SD400M03 245D 5W 10X




Description:

SD

400

M

254D

5W

10X

Abrasive

Grit

Bond

O.D.

W


X


SD synthetic diamond

270-8000

M

200-304

2-7

5-10



Bond

Type

Material of workpieces

Application


Features

Metal

M

Sapphire

Rough grinding

Long life

Vitrified

V

silicon wafer

Rough/fine grinding

Porous and used for grinding common&ultra-thin silicon wafer

Resin

R

Sapphire

Rough/fine grinding

High Efficiency





HOW TO MAKE AN ORDER          

More details for your description,more proper blades or wheels you could get,please let us know :            

Type :such as 1A8.1V8,1E8...  

Size:Diameter,Thickness,Hole,Width and depth of abrasive layer,angle                      

Specification Abrasive(D or CBN),Grit,Bond,Concentration  

Work-piece Material ,Grinding process(wet or dry)  


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